The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2019

Filed:

Sep. 27, 2018
Applicants:

Tsinghua University, Beijing, CN;

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Xiang Jin, Beijing, CN;

Zi-Peng Wu, Beijing, CN;

Wen-Tao Miao, Beijing, CN;

Kai-Li Jiang, Beijing, CN;

Shou-Shan Fan, Beijing, CN;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/30 (2006.01); H01L 23/00 (2006.01); C01B 32/158 (2017.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); C01B 32/158 (2017.08); H01L 24/05 (2013.01); H01L 2224/83048 (2013.01); H01L 2224/83493 (2013.01);
Abstract

A bonding method is provided. A sheet structure is placed on a substrate surface, and a surface roughness of a surface of the sheet structure is less than or equal to 1.0 micrometer. A carbon nanotube structure is laid on the surface of the sheet structure. Two ends of the carbon nanotube structure are in direct contact with the substrate surface. An organic solvent is added to the two ends of the carbon nanotube structure. An object is laid on the carbon nanotube structure, and a surface of the object being in direct contact with the carbon nanotube structure has a surface roughness less than or equal to 1.0 micrometer.


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