Chongqing, China

Zhonghua Wang

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Ccteg Chongqing Research Institute. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhonghua Wang. Retrieved from https://idiyas.com/inventor/zhonghua-wang-p70e9z2d

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

Average Co-Inventor Count = 17.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Zhonghua Wang and His Contributions to Mining Technology.

Introduction

Zhonghua Wang is an inventor based in Chongqing, China, associated with CCTEG Chongqing Research Institute. His work includes inventions for coal seam pressure relief, permeability improvement, and mining equipment. The supplied information lists 2 patents.

Latest Patents

Wang’s listed patents include “Rear-Mounted Double-Channel Abrasive Jet Cutting Device.” The invention uses separate channels to convey high-pressure water and abrasive material. This arrangement is designed to reduce wear on hoses and drilling tools, prevent pressure loss in the water channel, improve coal-breaking performance, and extend the cutting apparatus’s service life.

His other listed patent is “Mining Hose Connecting Device and Method,” which concerns equipment and methods for connecting mining hoses.

Career Highlights

Wang’s listed inventions address practical challenges in mining operations, particularly the durability and performance of high-pressure jet cutting equipment. His work is associated with CCTEG Chongqing Research Institute.

Collaborations

The supplied information identifies Yongjiang Zhang and Lindong Guo as Wang’s coworkers.

Conclusion

Zhonghua Wang’s listed patent work focuses on mining equipment, including a double-channel abrasive jet cutting device intended to improve cutting performance and equipment longevity.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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