Zhiwei (Will) Liu

Title: Zhiwei (Will) Liu: Innovator in Contact Technology

Introduction

Zhiwei (Will) Liu is a notable inventor based in Dongguan, China. He has made significant contributions to the field of contact technology, particularly with his innovative designs that enhance connectivity solutions. His work is characterized by a focus on practical applications and efficiency.

Latest Patents

Zhiwei Liu holds a patent for a "Shaped Contact." This invention features a flag shape contact that includes a substrate and a plug-in structure designed to receive a mating contact. The plug-in structure extends from the substrate in a first direction, while a riveting structure is provided for connecting a wire conductor to the contact. This riveting structure extends from the substrate in a second direction, distinct from the first direction, and is positioned outside the extension area of the plug-in structure. He has 1 patent to his name.

Career Highlights

Throughout his career, Zhiwei Liu has worked with prominent companies in the electronics industry. He has been associated with Tyco Electronics (Shanghai) Co., Ltd. and Tyco Electronics (Dongguan) Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Zhiwei Liu has collaborated with talented individuals in his field, including Jianchou (Jackson) Chen and YuQiang (Thomas) Zhao. These collaborations have fostered a creative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

Zhiwei (Will) Liu is a distinguished inventor whose work in contact technology has made a significant impact. His innovative designs and collaborations with industry professionals highlight his commitment to advancing technology.