Zhimin Song

Title: Zhimin Song: Innovator in Integrated Device Packaging

Introduction

Zhimin Song is a notable inventor based in San Diego, California. He has made significant contributions to the field of integrated device packaging, particularly through his innovative patent. His work is recognized within the technology sector, especially at Qualcomm Incorporated, where he applies his expertise.

Latest Patents

Zhimin Song holds a patent for a "Package comprising a substrate and a high-density interconnect integrated device." This invention involves a package that includes a substrate, a first integrated device, a second integrated device, and an interconnect integrated device. The design features a cavity within the substrate, with the interconnect integrated device positioned over this cavity. The underfill is strategically placed between the various components to enhance the device's performance and reliability. This patent showcases his ability to innovate in complex electronic packaging solutions. He has 1 patent to his name.

Career Highlights

Throughout his career, Zhimin has been associated with Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His role at Qualcomm has allowed him to work on cutting-edge technologies and contribute to advancements in integrated device packaging.

Collaborations

Zhimin collaborates with talented individuals such as Yangyang Sun and Li-Sheng Weng. Their teamwork fosters an environment of innovation and creativity, leading to the development of advanced technologies in their field.

Conclusion

Zhimin Song is a distinguished inventor whose work in integrated device packaging has made a significant impact in the technology sector. His contributions, particularly through his patent, highlight his innovative spirit and dedication to advancing electronic device technology.