Chengdu, China

Zhifei Du

This inventor holds 1 USPTO granted patent. Top assignee: Chengdu University of Technology. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhifei Du. Retrieved from https://idiyas.com/inventor/zhifei-du

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Zhifei Du: Innovator in Anti-Adhesion Crushing Technology

Introduction

Zhifei Du is a notable inventor based in Chengdu, China. He has made significant contributions to the field of crushing technology, particularly in improving the efficiency of processing damp ores. His innovative approach addresses common challenges faced in the industry.

Latest Patents

Zhifei Du holds a patent for an "Anti-adhesion crushing tool for crushing damp ores." This invention is designed to enhance the working environment during the crushing of attapulgite, a type of clay. The tool effectively improves the anti-adhesion properties of attapulgite clay, making the crushing process more efficient and less problematic.

Career Highlights

Zhifei Du is affiliated with Chengdu University of Technology, where he continues to engage in research and development. His work focuses on advancing technologies that can benefit various industrial applications. With a patent portfolio that includes 1 patent, he demonstrates a commitment to innovation in his field.

Collaborations

Zhifei Du collaborates with esteemed colleagues such as Xingqiao Deng and Chengfu Li. These partnerships enhance the research and development efforts at Chengdu University of Technology, fostering a collaborative environment for innovation.

Conclusion

Zhifei Du's contributions to anti-adhesion crushing technology highlight his role as an important inventor in the field. His work not only improves industrial processes but also sets a foundation for future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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