Ningde, China

Zhifang Dai

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2021-2022

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2 patents (USPTO):Explore Patents

Title: Zhifang Dai: Innovator in Gummed Paper Technology

Introduction

Zhifang Dai is a notable inventor based in Ningde, China, recognized for his contributions to the field of gummed paper technology. With a total of two patents to his name, Dai has made significant advancements that enhance the functionality and application of gummed paper products.

Latest Patents

Zhifang Dai's latest patents include innovative designs for gummed paper. The first patent describes a gummed paper that comprises a first substrate with an uncovered region on its upper surface, and a second substrate that partially covers the first substrate. Notably, the dyne value of the upper surface of the second substrate is greater than or equal to 40 dyn/cm, while the dyne value of the uncovered region is less than that of the upper surface. The second patent outlines a gummed paper that includes a first adhesive layer designed to adhere to an object, a first substrate adhered to the opposite surface of the adhesive layer, and a second adhesive layer adhered to the first substrate. Additionally, it features a second substrate and a plurality of foaming agent particles distributed within the first adhesive layer.

Career Highlights

Zhifang Dai is currently employed at Ningde Amperex Technology Limited, where he continues to innovate and develop new products. His work has positioned him as a key figure in the advancement of adhesive technologies.

Collaborations

Dai collaborates with talented coworkers, including Luran Zhang and Hai Long, who contribute to the innovative environment at Ningde Amperex Technology Limited.

Conclusion

Zhifang Dai's contributions to gummed paper technology reflect his commitment to innovation and excellence in his field. His patents not only enhance product functionality but also pave the way for future advancements in adhesive technologies.

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