Suzhou, China

Zhide Dong

This inventor holds 1 USPTO granted patent and 1 published patent application and 1 EPO patent. Top assignees: Tyco Electronics (Suzhou) Ltd., Tyco Electronics Technology (Sip) Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhide Dong. Retrieved from https://idiyas.com/inventor/zhide-dong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Zhide Dong and His Connector Invention.

Introduction

Zhide Dong is an inventor based in Suzhou, China. His patent work includes a connector design that uses a detachable sub connector to support electrical connection and mating.

Latest Patents

Dong is associated with 1 patent: “Sub connector, connector, and connector assembly.” The invention describes a sub connector with a sub housing, a first terminal fixed within the housing, and a shielding shell that at least partially encloses the terminal. The sub connector can be detachably inserted into a mother housing to form a connector. It includes a connecting end for electrical connection to a component and a mating end designed to mate electrically with another connector.

Career Highlights

Dong’s listed company affiliations include Tyco Electronics Technology (Sip) Ltd. and Tyco Electronics (Suzhou) Ltd. His patent reflects work on connector structures and electrical interconnection.

Collaborations

Dong’s listed coworkers include Yingying Ji and Zhiming Feng.

Conclusion

Zhide Dong’s patent describes a modular connector assembly that combines a detachable sub connector, terminal, and shielding shell for electrical connection and mating.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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