Kyoto, Japan

Zhida Wang

This inventor holds 1 USPTO granted patent. Top assignee: Screen Holdings Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhida Wang. Retrieved from https://idiyas.com/inventor/zhida-wang-a45zxhei

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Zhida Wang: Innovator in Substrate Processing Technology

Introduction

Zhida Wang is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of substrate processing, particularly through his innovative techniques that enhance the efficiency of processing methods.

Latest Patents

Zhida Wang holds a patent for a substrate processing method and apparatus. This invention focuses on a substrate processing technique that involves a sequence of pressure steps within a processing container. The method includes a pressure increasing step, a pressure keeping step, and a pressure reducing step. During this process, the flow rate of the processing fluid is controlled to promote mutual diffusion between the processing fluid and a liquid in the processing space. This innovative approach ultimately leads to improved drying of the substrate by effectively discharging the processing fluid.

Career Highlights

Zhida Wang is currently employed at Screen Holdings Co., Ltd., where he continues to develop and refine his innovative ideas. His work has been instrumental in advancing substrate processing technologies, making significant impacts in various applications.

Collaborations

Zhida Wang collaborates with talented colleagues, including Koji Ando and Noritake Sumi. Their combined expertise fosters a creative environment that drives innovation in their projects.

Conclusion

Zhida Wang's contributions to substrate processing technology exemplify the spirit of innovation. His patented methods not only enhance processing efficiency but also pave the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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