Tamano, Japan

Zhida Wang

This inventor holds 1 USPTO granted patent and 6 published patent applications. Top assignee: Admap Inc.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhida Wang. Retrieved from https://idiyas.com/inventor/zhida-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Zhida Wang - Innovator in SiC Technology

Introduction

Zhida Wang is a notable inventor based in Tamano, Japan. He has made significant contributions to the field of semiconductor technology, particularly with his innovative work on silicon carbide (SiC) members. His expertise and creativity have led to advancements that enhance the performance and appearance of SiC components.

Latest Patents

Zhida Wang holds 1 patent for his invention titled "SiC member." This technology focuses on securing a favorable appearance of a SiC member, which includes a first SiC layer with a concavo-convex shape on its upper surface and a second SiC layer that complements this design. The second layer features a recess that is concaved from the upper surface toward the lower surface, ensuring that the bottom surface of the recess is positioned above the second lower surface. This innovative design not only improves the aesthetic quality of SiC members but also enhances their functional properties.

Career Highlights

Zhida Wang is currently associated with Admap Inc., where he continues to develop cutting-edge technologies in the semiconductor industry. His work at Admap Inc. reflects his commitment to innovation and excellence in engineering.

Collaborations

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Conclusion

Zhida Wang's contributions to SiC technology exemplify the impact of innovative thinking in the semiconductor field. His patent on the SiC member showcases his ability to blend functionality with aesthetic appeal, marking him as a significant figure in modern engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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