This inventor holds 1 USPTO granted patent. Top assignee: Wuhan Choice Technology Co., Ltd. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Zhicong Lv and Wafer-Thinning Technology.
Introduction
Zhicong Lv is an inventor based in Wuhan, China. His work includes a patent for wafer-thinning technology designed to support wafer grinding while addressing static electricity, adhesive residue, and water penetration.
Latest Patents
Lv is associated with 1 patent: “Wafer Thinning Tape and Preparation Method Thereof, and Wafer Grinding Method.” The invention describes a wafer-thinning tape made of a tape layer, a base film layer, and a conductive coating. The base film is made of TPU, and the conductive coating uses silver nanowires. The tape layer includes acrylic adhesive, curing agent, and antistatic agent, with the curing agent specified at 3%–4% and the antistatic agent at 1%–2% of the acrylic adhesive’s mass.
The patent describes the tape as having antistatic properties intended to inhibit static electricity during peeling. It is also designed to peel without leaving residue and to help prevent water penetration during wafer grinding.
Career Highlights
Lv is associated with Wuhan Choice Technology Co., Ltd. His patent focuses on materials and methods for wafer processing, particularly the practical challenges involved in thinning and grinding wafers.
Collaborations
The provided information lists De Wu and Shuhang Liao as Lv’s coworkers. Their specific roles in the patent or related work are not stated.
Conclusion
Zhicong Lv’s documented invention addresses key wafer-grinding concerns through an antistatic, residue-conscious, and water-resistant wafer-thinning tape.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile