This inventor holds 1 USPTO granted patent. Top assignees: Avary Holding (Shenzhen) Co., Limited., Garuda Technology Co., Ltd., Qing Ding Precision Electronics (Huaian) Co., Ltd. Active years: 2026.
Company Filing History:
1 out of 199 
1 out of 14 
1 out of 8 Years Active: 2026
Title: Zhi-cheng Lan: Innovator in Packaging Technology
Introduction
Zhi-cheng Lan is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of packaging technology. His innovative approach has led to the development of a unique packaging structure that enhances the functionality and efficiency of electronic components.
Latest Patents
Zhi-cheng Lan holds 1 patent for his invention titled "Packaging structure, packaging substrate, and manufacturing method of the packaging structure." This patent describes a packaging substrate that includes a circuit board defining a through groove. The circuit board consists of an insulating body and a first wiring layer formed on the insulating body. A colloid is formed in the through groove, and the packaging substrate further includes at least one lead. Each lead comprises a lead body and a lead terminal connected to an end of the lead body. The lead terminal protrudes from the colloid, while another end of the lead body is electrically connected to the circuit board, with the colloid covering the lead body.
Career Highlights
Throughout his career, Zhi-cheng Lan has worked with several prominent companies. He has been associated with Qing Ding Precision Electronics (Huaian) Co., Ltd and Avary Holding (Shenzhen) Co., Limited. His experience in these organizations has contributed to his expertise in packaging technology and innovation.
Collaborations
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Conclusion
Zhi-cheng Lan's contributions to packaging technology exemplify his innovative spirit and dedication to advancing the field. His patent reflects a significant step forward in the design and functionality of packaging substrates for electronic components.