This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Shenzhen Dancing Future Technology Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Zhenlong Xie and Flexible Printed Circuit Encapsulation
Introduction
Zhenlong Xie is an inventor associated with Shenzhen, China, and Shenzhen Dancing Future Technology Ltd. His patent work addresses the production and encapsulation of flexible printed circuit structures.
Latest Patents
Xie is named on 1 patent: “Production Process of Flexible Printed Circuit Encapsulation Structure and Flexible Printed Circuit Encapsulation Structure.” The invention describes a process that integrates a flexible printed circuit board with molding tape, assembles connector components onto an elastic support body, and joins these components into a main assembly. The completed structure is then overmolded with soft rubber to form a protective jacket. The disclosed approach is intended to accommodate larger deformation amplitudes and higher deformation frequencies.
Career Highlights
Xie’s patent reflects work on manufacturing methods for flexible electronic structures. By combining circuit overmolding, support-body assembly, connector integration, and a final soft-rubber layer, the process aims to produce an encapsulated structure suited to repeated deformation.
Collaborations
The supplied information identifies Jianhui Huang and Shuisong Liu as Xie’s coworkers at Shenzhen Dancing Future Technology Ltd. Their specific roles in the patent or related development work were not provided.
Conclusion
Zhenlong Xie’s disclosed invention focuses on a flexible printed circuit encapsulation process designed to support demanding deformation requirements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile