Zhengyuan Wei

Title: Innovations of Zhengyuan Wei in Dynamic Measurement of Rotating-Body Molds

Introduction

Zhengyuan Wei is a notable inventor based in Nanjing, China. He has made significant contributions to the field of dynamic measurement, particularly in the context of rotating-body molds. His innovative approach has led to the development of a unique method that enhances the accuracy of deformation measurements during the rotation process.

Latest Patents

Zhengyuan Wei holds a patent for a method titled "Method for dynamically measuring deformation of rotating-body mold." This method involves several key steps: first, it subjects the overall outer surface of the rotating-body mold to three-dimensional measurement to acquire initial point cloud data. Next, a multi-camera system captures images of the mold from various angles to obtain three-dimensional coordinates of marking points and coding points on the mold's surface. The mold is then rotated, and the marking and coding points are photographed under different angles. This data is used to calculate the three-dimensional coordinates of these points. Finally, the method predicts point cloud data of the outer surface under different angles to analyze the deformation degree of the mold during rotation.

Career Highlights

Zhengyuan Wei is affiliated with the Nanjing University of Aeronautics and Astronautics, where he contributes to research and development in his field. His work is characterized by a strong focus on practical applications of measurement technologies, which are crucial for advancements in aeronautics and astronautics.

Collaborations

Zhengyuan Wei collaborates with esteemed colleagues such as Zhongde Shan and Jun Wang. Their combined expertise fosters an environment of innovation and progress in their research endeavors.

Conclusion

Zhengyuan Wei's contributions to the field of dynamic measurement are noteworthy, particularly his patented method for measuring deformation in rotating-body molds. His work not only advances technological capabilities but also enhances the understanding of mold dynamics in various applications.