The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 03, 2023

Filed:

Jan. 13, 2022
Applicant:

Nanjing University of Aeronautics and Astronautics, Nanjing, CN;

Inventors:

Zhongde Shan, Nanjing, CN;

Jun Wang, Nanjing, CN;

Zhengyuan Wei, Nanjing, CN;

Honghua Chen, Nanjing, CN;

Qian Xie, Nanjing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2022.01); G06T 7/00 (2017.01); G06T 7/55 (2017.01); G06T 7/70 (2017.01); G06V 10/74 (2022.01); G06V 10/75 (2022.01); G06V 10/24 (2022.01); G06V 10/10 (2022.01); G01B 11/16 (2006.01); G01B 11/00 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G01B 11/002 (2013.01); G01B 11/16 (2013.01); G06T 7/55 (2017.01); G06T 7/70 (2017.01); G06T 7/97 (2017.01); G06V 10/16 (2022.01); G06V 10/19 (2022.01); G06V 10/242 (2022.01); G06V 10/754 (2022.01); G06V 10/761 (2022.01); G06T 2207/10028 (2013.01); G06T 2207/30108 (2013.01); G06T 2207/30116 (2013.01); G06V 2201/12 (2022.01);
Abstract

A method for dynamically measuring deformation of a rotating-body mold, including: (S) subjecting an overall outer surface of the rotating-body mold to three-dimensional measurement to acquire an initial point cloud data; (S) shooting, by a multi-camera system, the mold from different angles to obtain three-dimensional coordinates of marking points and coding points on the overall outer surface of the rotating-body mold; (S) rotating the mold, and repeatedly photographing the marking points and the coding points on the mold surface under different angle poses; and calculating three-dimensional coordinates of the marking points and the coding points; and (S) predicting a point cloud data of the outer surface under different angle poses based on a conversion relationship among the marking points to analyze a deformation degree of the mold during a rotation process.


Find Patent Forward Citations

Loading…