This inventor holds 1 USPTO granted patent. Top assignee: Beijing Baidu Netcom Science and Technology Co., Ltd.. Active years: 2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2023
Title: Innovations of Zhenghui Wu in Chip Packaging Technology
Introduction
Zhenghui Wu is an accomplished inventor based in Beijing, China. He has made significant contributions to the field of chip packaging technology. His innovative work has led to the development of a unique chip package and electronic device.
Latest Patents
Zhenghui Wu holds a patent for a chip package and electronic device. The patent describes a chip package that includes a package substrate, a semiconductor substrate, and two chips. The semiconductor substrate features a first group of pins and a second group of pins, which are interconnected through a connecting layer with multiple connecting channels. This design allows for efficient connectivity between the chips, enhancing the overall functionality of electronic devices.
Career Highlights
Zhenghui Wu is currently employed at Beijing Baidu Netcom Science and Technology Co., Ltd. His work at this prominent technology company has allowed him to focus on advancing chip packaging solutions. His innovative approach has positioned him as a key player in the industry.
Collaborations
Zhenghui Wu collaborates with Canghai Gu, a fellow inventor. Together, they work on various projects that aim to push the boundaries of technology in their field.
Conclusion
Zhenghui Wu's contributions to chip packaging technology demonstrate his expertise and innovative spirit. His patent reflects a significant advancement in electronic device design, showcasing his role as a leading inventor in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile