Foshan, China

Zhengbo Feng

This inventor holds 1 USPTO granted patent and 7 published patent applications and 2 EPO patents. Top assignees: Gd Midea Heating & Ventilating Equipment Co., Ltd., Hefei Midea Heating & Ventilating Equipment Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhengbo Feng. Retrieved from https://idiyas.com/inventor/zhengbo-feng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

 

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Zhengbo Feng: Air-Conditioning Heat Exchanger Innovation.

Introduction

Zhengbo Feng is an inventor based in Foshan, China. His work includes an air-conditioning design that addresses the sealing gap in an indoor unit’s heat exchanger while accommodating a water pump.

Latest Patents

Feng is associated with 1 patent: “Heat exchanger sealing plate for air conditioner, indoor unit and air conditioner.” The invention describes an indoor unit with a casing, an air-guiding ring, a heat exchanger, a sealing plate, and a water pump. The sealing plate connects to both ends of the heat exchanger to close the gap between them, and includes a mounting portion for the water pump.

Career Highlights

Feng is associated with Hefei Midea Heating & Ventilating Equipment Co., Ltd. and Guangdong Midea Heating & Ventilating Equipment Co., Ltd. His patent reflects work on components for air-conditioning systems and indoor-unit design.

Collaborations

Feng’s listed coworkers include Lichao Wen and Yong Gu, reflecting collaborative activity in the air-conditioning and heat-exchanger field.

Conclusion

Zhengbo Feng’s patent focuses on a sealing plate that closes a heat-exchanger gap and provides a mounting point for a water pump, contributing to the design of air-conditioning indoor units.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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