Urbana, IL, United States of America

Zheng Yan

This inventor holds 1 USPTO granted patent. Top assignees: Northwestern University, University of Illinois. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zheng Yan. Retrieved from https://idiyas.com/inventor/zheng-yan-3evwwilh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Innovations in 3D Architecture by Zheng Yan

Introduction

Zheng Yan is an accomplished inventor based in Urbana, IL. He has made significant contributions to the field of engineering, particularly in the area of three-dimensional architecture. His innovative work focuses on the deterministic assembly of complex structures, which has important implications for advanced microsystem technologies.

Latest Patents

Zheng Yan holds a patent titled "Deterministic assembly of complex, three-dimensional architectures by compressive buckling." This patent presents origami- and kirigami-inspired assembly techniques for creating predetermined three-dimensional forms. The comprehensive theoretical and experimental studies he conducted showcase a broad range of topologies and material compositions. The engineering options resulting from this work are poised to enhance the construction of functional 3D structures.

Career Highlights

Throughout his career, Zheng Yan has worked with prestigious institutions, including the University of Illinois and Northwestern University. His research has garnered attention for its innovative approach to engineering and design.

Collaborations

Zheng Yan has collaborated with notable colleagues, including John A. Rogers and Sheng Xu. Their combined expertise has contributed to advancements in the field of microsystem technologies.

Conclusion

Zheng Yan's work in the deterministic assembly of three-dimensional architectures represents a significant advancement in engineering. His innovative approaches and collaborations continue to influence the development of functional 3D structures.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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