Zheng-ting Jiao

Title: Zheng-ting Jiao: Innovator in Multilayer Circuit Board Technology

Introduction

Zheng-ting Jiao is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of electronics, particularly in the manufacturing of multilayer circuit boards. His innovative approach has led to the development of a unique method that enhances the efficiency and functionality of electronic devices.

Latest Patents

Zheng-ting Jiao holds a patent for a "Method for manufacturing a multilayer circuit board." This method involves several steps, including providing an inner circuit substrate with a through hole, attaching a support plate, and placing an electronic module within the hole. The process further includes pressing substrates onto the inner circuit substrate to encapsulate the electronic module, ultimately forming a multilayer circuit board. This invention showcases his expertise in circuit design and manufacturing techniques.

Career Highlights

Throughout his career, Zheng-ting Jiao has worked with prominent companies in the electronics industry. He has been associated with Qing Ding Precision Electronics (Huaian) Co., Ltd and Avary Holding (Shenzhen) Co., Limited. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Zheng-ting Jiao has collaborated with talented individuals in his field, including Lan-ting Chao and Yin-Ju Chen. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

Zheng-ting Jiao is a distinguished inventor whose work in multilayer circuit board technology has made a significant impact in the electronics sector. His innovative methods and collaborations highlight his commitment to advancing technology and improving electronic manufacturing processes.