Taipei, Taiwan

Zheng Li

This inventor holds 1 USPTO granted patent. Top assignee: Advanced-Connectek Inc.. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zheng Li. Retrieved from https://idiyas.com/inventor/zheng-li-e0xz0y2i

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 10.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: The Innovations of Zheng Li

Introduction

Zheng Li is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of connector technology, particularly with his innovative designs that enhance connectivity solutions.

Latest Patents

Zheng Li holds a patent for a board-to-board connector and board-to-board connector assembly. This invention includes a body, multiple terminals, and a pair of metal fittings. The body features an accommodating recess, and each terminal is strategically placed to extend into this recess. The metal fittings are positioned beside the accommodating recess, with terminals located between them. Each metal fitting includes a limiting portion that leans against a corner of the recess, creating a two-dimensional limitation that enhances the connector's functionality.

Career Highlights

Zheng Li is currently employed at Advanced-Connectek Inc., where he continues to develop innovative solutions in the field of connectivity. His work has been instrumental in advancing the technology used in various electronic applications.

Collaborations

Zheng has collaborated with talented coworkers, including Meng Liu and Wen-Liang Men, who contribute to the innovative environment at Advanced-Connectek Inc.

Conclusion

Zheng Li's contributions to the field of connector technology exemplify the spirit of innovation. His patent for a board-to-board connector showcases his ability to solve complex engineering challenges. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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