Shanghai, China

Zhenfei Peng

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Smarter Microelectronics (Shanghai) Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zhenfei Peng. Retrieved from https://idiyas.com/inventor/zhenfei-peng-swpfl3nx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Zhenfei Peng: Radio Frequency Power Amplifier Inventor

Introduction

Zhenfei Peng is an inventor based in Shanghai, China, whose patent work includes radio frequency power amplifier technology. He is associated with Smarter Microelectronics (Shanghai) Co., Ltd. His listed portfolio includes 1 patent.

Latest Patents

Peng is named on the patent “RF Power Amplifiers and Electronic Device.” The invention describes a radio frequency power amplifier with main and auxiliary amplifiers, matching circuits, and an impedance conversion circuit. The main matching circuit adjusts the phase of the main amplifier’s signal and raises its output impedance. The auxiliary matching circuit performs corresponding functions for the auxiliary amplifier’s signal, using a multistage impedance-matching circuit. Both signal paths connect at a combining node, which is connected to the impedance conversion circuit.

Career Highlights

Peng’s listed patent reflects work on amplifier architecture and impedance matching for electronic devices. His company affiliation is Smarter Microelectronics (Shanghai) Co., Ltd.

Collaborations

Peng’s listed coworkers include Lei Huang and Yiwei Hou.

Conclusion

Zhenfei Peng’s patent on radio frequency power amplifiers highlights his contribution to amplifier and impedance-matching technology through his work associated with Smarter Microelectronics (Shanghai) Co., Ltd.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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