Beijing, China

Zesen Nie

This inventor holds 3 USPTO granted patents and 4 published patent applications. Top assignee: Bitmain Technologies Limited. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zesen Nie. Retrieved from https://idiyas.com/inventor/zesen-nie

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.4

ph-index = 1


Company Filing History:


Years Active: 2026

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3 patents (USPTO):Explore Patents

Title: Zesen Nie: Cooling and Thermal-Management Inventions.

Introduction

Zesen Nie is an inventor based in Beijing, China, with 3 patents. His disclosed work includes technologies for improving cooling-tower sand removal and heat dissipation. He is associated with Bitmain Technologies Limited.

Latest Patents

Nie’s listed patents include a sand removal device for a cooling tower and a cooling tower structure. The invention combines a flushing assembly, which directs liquid toward the tower’s bottom, with a cyclone sand removal assembly that extracts the liquid, separates sand, and returns the treated liquid. The design aims to improve sand removal from the liquid.

Another listed invention, a cooling device, uses two plate bodies. A flow channel formed on the first plate accommodates fluid and consists of straight segments connected by one or more bent segments. The arrangement is designed to enhance heat dissipation.

Career Highlights

Nie’s patent portfolio reflects work on practical cooling systems, including equipment for treating liquid in cooling towers and a plate-based device for thermal management. His association with Bitmain Technologies Limited places these inventions within a company known for technology development.

Collaborations

Nie’s listed coworkers include Te Pi and Fengjie Li.

Conclusion

Zesen Nie’s disclosed inventions focus on improving cooling performance through more effective sand removal and heat dissipation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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