Shanghai, China

Zeqiang Fu

This inventor holds 1 USPTO granted patent. Top assignee: Montage Electronics (Shanghai) Co., Ltd.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zeqiang Fu. Retrieved from https://idiyas.com/inventor/zeqiang-fu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Zeqiang Fu: Innovator in Hot-Plugging Technology

Introduction

Zeqiang Fu is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of technology, particularly in the area of hot-plugging control methods. His innovative approach has led to the development of a unique patent that addresses common challenges in device connectivity.

Latest Patents

Zeqiang Fu holds a patent for a "Hot-plugging control method, device and retimer." This patent outlines a method that includes receiving data from a pluggable device, sending it to a receiving controller (RC), and detecting the connection status of the device. Notably, the method allows for hot-plugging without the need for presence signals, thus overcoming limitations faced by many devices in the market. This innovation enhances the usability and functionality of pluggable devices.

Career Highlights

Zeqiang Fu is currently employed at Montage Electronics (Shanghai) Co., Ltd. His work at this company has allowed him to focus on advancing technology in the electronics sector. His expertise in hot-plugging technology has positioned him as a valuable asset in his field.

Collaborations

Zeqiang Fu collaborates with talented individuals such as Hankang Li and Yuxiang Liao. Their combined efforts contribute to the innovative projects at Montage Electronics, fostering a collaborative environment that encourages technological advancements.

Conclusion

Zeqiang Fu's contributions to hot-plugging technology exemplify his commitment to innovation in the electronics industry. His patent not only addresses existing challenges but also paves the way for future advancements in device connectivity.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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