ZeLin Wu

Title: Innovations by ZeLin Wu in Solder Joint Measurement

Introduction

ZeLin Wu is an accomplished inventor based in Shanghai, China. He has made significant contributions to the field of measurement technology, particularly in the detection of defects in solder joints. His innovative approach has led to the development of a patented method that enhances the accuracy of measurement machines.

Latest Patents

ZeLin Wu holds a patent for a "Measurement machine and method for detecting a defect in solder joints." This patent focuses on an inspection method that trains measurement machines to accurately measure side joint lengths and detect defects among multiple solder joints. The method involves receiving data from two measurement machines, determining a correlation value through statistical analysis, and updating the algorithm used by the first measurement machine. This updated algorithm is then employed for dimensional metrology to identify defects in solder joints.

Career Highlights

ZeLin Wu is currently employed at Hewlett Packard Enterprise Development LP, where he continues to innovate in the field of measurement technology. His work has been instrumental in improving the reliability and efficiency of solder joint inspections.

Collaborations

Some of his notable coworkers include Jaime E Llinas and Saravanan Rathakrishnan, who contribute to the collaborative environment that fosters innovation at Hewlett Packard Enterprise Development LP.

Conclusion

ZeLin Wu's contributions to measurement technology, particularly in solder joint inspection, demonstrate his commitment to innovation and excellence. His patented methods are paving the way for more accurate and efficient manufacturing processes.