The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 12, 2024
Filed:
Aug. 17, 2021
Hewlett Packard Enterprise Development Lp, Houston, TX (US);
Jaime E. Llinas, Houston, TX (US);
Saravanan Rathakrishnan, Putrajaya, MY;
Yanyan Xia, Shanghai, CN;
ZeLin Wu, Shanghai, CN;
Yanli Li, TianJin, CN;
JunHui Li, Shanghai, CN;
Jian Miremadi, Sunnyvale, CA (US);
Hewlett Packard Enterprise Development LP, Spring, TX (US);
Abstract
Example implementations relate to an inspection method for training a measurement machine to accurately measure side joint lengths and detecting a defect among a plurality of solder joints. The method includes receiving a first data representing the side joint lengths of the plurality of solder joints measured by a first measurement machine and a second data representing the side joint lengths measured by a second measurement machine. Further, the method includes determining a correlation value based on a statistical analysis of a relationship between the first data and the second data. The method further includes updating an algorithm used by the first measurement machine to measure the side joint lengths, based on the correlation value to reduce deviation between the first data and the second data. Later, the updated algorithm is used as a dimensional metrology in the first measurement machine for detecting the defect in the solder joints.