Ze-Jie Li

Title: Ze-Jie Li: Innovator in Packaging Technology

Introduction

Ze-Jie Li is a notable inventor based in Qinhuangdao, China. He has made significant contributions to the field of packaging technology, particularly in the development of structures that incorporate electronic components. His innovative approach has led to advancements that enhance the efficiency and reliability of electronic packaging.

Latest Patents

One of Ze-Jie Li's key patents is titled "Packaging structure with embedded electronic components and method for manufacturing the same." This patent describes a method for creating a fan-out chip packaging structure that reduces the reliance on a crack-inducing hot-soldering process. The design features a first carrier plate with outer wiring layers and conductive posts that facilitate the embedding of components, ultimately improving the manufacturing process.

Career Highlights

Throughout his career, Ze-Jie Li has worked with several prominent companies, including Hongqisheng Precision Electronics Co., Ltd. and Avary Holding (Shenzhen) Co., Limited. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects in the electronics sector.

Collaborations

Ze-Jie Li has collaborated with talented individuals such as Chih-Chieh Fu and Yuan-Yu Lin. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Ze-Jie Li's work in packaging technology exemplifies the impact of innovation in the electronics industry. His contributions continue to shape the future of electronic component integration and manufacturing processes.