Troy, MI, United States of America

Zdenek Severa

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Magna Exteriors Gmbh. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Zdenek Severa. Retrieved from https://idiyas.com/inventor/zdenek-severa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Zdenek Severa and Variable-Frequency Microwave Joining

Introduction

Zdenek Severa is an inventor associated with Troy, Michigan, and Magna Exteriors GmbH. His patent work addresses a faster way to bond untreated plastic substrates using variable-frequency microwave technology.

Latest Patents

Severa is credited with 1 patent: “Variable Frequency Microwave Joining—Bonded Untreated Plastic Substrates and Process for Manufacturing Same.” The invention describes a one-component epoxy welding paste that reacts to variable-frequency microwaves and can wet and bond untreated plastic substrates, including polypropylene.

Microwave curing hardens the paste, enabling thermoplastic panels to be joined quickly without surface treatment. The approach is designed to reduce production cycle time, production and operating costs, and the space required on production lines.

Career Highlights

Severa’s listed patent highlights an industrial bonding process that combines untreated substrates with microwave-reactive adhesive. By avoiding panel surface treatment, the method offers a potential simplification of thermoplastic assembly.

Collaborations

Severa is associated with Magna Exteriors GmbH. Marek Pospisek is identified as a coworker.

Conclusion

Zdenek Severa’s patent focuses on using variable-frequency microwave curing to make bonding untreated plastic substrates faster and potentially more efficient.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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