This inventor holds 1 USPTO granted patent. Top assignee: Hitachi Chemical Company, Ltd.. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: Yuusuke Yasuda: Innovator in Electrically Conductive Bonding Materials
Introduction
Yuusuke Yasuda is a notable inventor based in Hitachi, Japan. He has made significant contributions to the field of semiconductor technology through his innovative work on bonding materials.
Latest Patents
Yuusuke Yasuda holds a patent for an electrically conductive bonding material, a method of bonding with the same, and a semiconductor device bonded with the same. This invention provides a bonding material and method that achieves higher bonding strength at lower temperatures without the need for pressure. The bonding material consists of silver particles, silver oxide, and a dispersant made from organic material containing no more than 30 carbon atoms. The total weight of these components ranges from 99.0% to 100%, ensuring that no resin binder is included.
Career Highlights
Yuusuke Yasuda is currently employed at Hitachi Chemical Company, Ltd., where he continues to develop innovative solutions in the field of materials science. His work has been instrumental in advancing the capabilities of semiconductor devices.
Collaborations
Yuusuke has collaborated with notable colleagues, including Toshiaki Morita and Eiichi Ide, contributing to the advancement of their shared projects and innovations.
Conclusion
Yuusuke Yasuda's contributions to electrically conductive bonding materials highlight his role as a key innovator in semiconductor technology. His work not only enhances bonding strength but also improves manufacturing processes in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile