The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2014
Filed:
Apr. 28, 2010
Applicants:
Yuusuke Yasuda, Hitachi, JP;
Toshiaki Morita, Hitachi, JP;
Eiichi Ide, Hitachi, JP;
Teiichi Inada, Tsukuba, JP;
Inventors:
Yuusuke Yasuda, Hitachi, JP;
Toshiaki Morita, Hitachi, JP;
Eiichi Ide, Hitachi, JP;
Teiichi Inada, Tsukuba, JP;
Assignee:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/00 (2006.01); H01B 1/12 (2006.01); H01L 23/15 (2006.01); C22C 1/05 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01); H01L 23/488 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); B22F 1/00 (2006.01); H01L 23/492 (2006.01); H01B 1/22 (2006.01); H01L 25/07 (2006.01); H01L 23/34 (2006.01); B23K 20/00 (2006.01); B23K 28/00 (2006.01); B05D 5/12 (2006.01); H01L 23/24 (2006.01); H01L 21/56 (2006.01); H01L 23/10 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 23/049 (2006.01);
U.S. Cl.
CPC ...
B22F 1/0074 (2013.01); H01L 2224/2919 (2013.01); H01L 2924/01028 (2013.01); H01L 2224/48755 (2013.01); H01L 23/24 (2013.01); H01L 2924/01045 (2013.01); H01L 2224/29176 (2013.01); H01L 2924/13091 (2013.01); H01L 2224/29157 (2013.01); H01L 2924/01044 (2013.01); H01L 2224/8384 (2013.01); H01L 23/15 (2013.01); H01L 2224/48855 (2013.01); H01L 2224/29363 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/01077 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/48839 (2013.01); H01L 2224/29118 (2013.01); H01L 2224/29294 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01046 (2013.01); H01L 2224/2936 (2013.01); H01L 2224/29311 (2013.01); H01L 2924/01074 (2013.01); H01L 2224/29166 (2013.01); H01L 21/565 (2013.01); H01L 2224/29155 (2013.01); H01L 2924/01076 (2013.01); H01L 2224/29173 (2013.01); H01L 23/10 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/01013 (2013.01); C22C 1/05 (2013.01); H01L 2224/29357 (2013.01); H01L 2224/2916 (2013.01); H01L 2224/2901 (2013.01); H01L 2924/3511 (2013.01); H01L 2224/29381 (2013.01); H01L 2224/29184 (2013.01); H01L 2224/29111 (2013.01); H01L 23/142 (2013.01); H01L 2924/19105 (2013.01); H01L 24/49 (2013.01); H01L 2224/29181 (2013.01); H01L 2224/29378 (2013.01); H01L 2924/0105 (2013.01); H01L 23/3735 (2013.01); H01L 2224/29355 (2013.01); H01L 2924/15787 (2013.01); H01L 23/488 (2013.01); H01L 2924/01014 (2013.01); H01L 2224/29078 (2013.01); H01L 2924/01006 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/83065 (2013.01); H01L 2224/29366 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/19043 (2013.01); H01L 2224/29369 (2013.01); H01L 2924/01047 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29376 (2013.01); H01L 2224/48472 (2013.01); H01L 23/49562 (2013.01); H01L 2224/29171 (2013.01); H01L 2224/29124 (2013.01); H01L 2924/01082 (2013.01); H01L 2224/29373 (2013.01); H01L 2224/29318 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/48739 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/29893 (2013.01); H01L 23/3121 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01024 (2013.01); H01L 23/13 (2013.01); H01L 2224/83075 (2013.01); H01L 24/83 (2013.01); H01L 24/29 (2013.01); H01L 2224/32505 (2013.01); H01L 2224/49111 (2013.01); H01L 2924/0665 (2013.01); H01L 2224/29139 (2013.01); H01L 23/498 (2013.01); H01L 2224/29324 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/0103 (2013.01); H01L 2224/29169 (2013.01); H01L 2224/29178 (2013.01); H01L 2224/29138 (2013.01); H01L 2224/45124 (2013.01); H01L 23/049 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/29384 (2013.01); H01L 2224/29338 (2013.01); H01L 2924/0132 (2013.01); H01L 2224/29387 (2013.01); H01L 2224/29005 (2013.01); H01L 23/49513 (2013.01); H01L 23/3107 (2013.01); H01L 23/492 (2013.01); H01B 1/22 (2013.01); H01L 2924/014 (2013.01); H01L 2224/29309 (2013.01); H01L 2924/19107 (2013.01); H01L 24/32 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01078 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/09701 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/29164 (2013.01); H01L 2224/48247 (2013.01); H01L 25/072 (2013.01); H01L 2224/45147 (2013.01); H01L 23/34 (2013.01); H01L 2224/832 (2013.01); H01L 2224/29163 (2013.01); H01L 2224/29109 (2013.01); H01L 2924/01079 (2013.01); H01L 24/48 (2013.01); H01L 2224/29371 (2013.01);
Abstract
The present invention provides a bonding material and a method of bonding for metal bonding at a bonding interface capable of a higher bonding strength at a lower temperature without application of pressure, compared to a bonding material of metal particles having an average particle size of not greater than 100 nm. An electrically conductive bonding material including (A) silver particles, (B) silver oxide, and (C) a dispersant including organic material containing not more than 30 carbon atoms as essential components, wherein a total amount of (A) the silver powder, (B) the silver oxide powder, and (C) the dispersant including an organic material containing not more than 30 carbon atoms is in a range of 99.0% to 100% by weight, is provided. In other words, no resin binder is contained.