Yuuki Numazaki

Title: Yuuki Numazaki: Innovator in Printed-Wiring Board Technology

Introduction

Yuuki Numazaki is a notable inventor based in Fukushima, Japan. He has made significant contributions to the field of printed-wiring board technology. His innovative approach has led to the development of a unique transfer sheet that enhances the manufacturing process.

Latest Patents

Numazaki holds a patent for a "Transfer sheet for making printed-wiring board by injection molding." This invention addresses the challenges of circuit damage during the injection molding process. The transfer sheet comprises a carrier film, a copper foil circuit, and a releasing layer that ensures excellent releasability. The releasing layer is designed to have a T-type peeling strength between the carrier film and the copper foil circuit of 0.025-0.25 kg/25 mm. The method for producing this transfer sheet involves several steps, including coating a releasing layer on a carrier film and pattern-printing an etching resist.

Career Highlights

Yuuki Numazaki is associated with Nitto Boseki Co., Ltd., where he continues to innovate in the field of printed-wiring boards. His work has garnered attention for its practical applications and efficiency improvements in manufacturing processes.

Collaborations

Numazaki collaborates with talented individuals such as Akihiko Watanabe and Naoto Kanno. Their combined expertise contributes to the advancement of technology in their field.

Conclusion

Yuuki Numazaki's contributions to printed-wiring board technology exemplify the spirit of innovation. His patented transfer sheet represents a significant advancement in manufacturing processes, showcasing his dedication to improving industry standards.