Tokyo, Japan

Yutaka Tsukada

This inventor holds 1 USPTO granted patent. Top assignee: Juki Corporation. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yutaka Tsukada. Retrieved from https://idiyas.com/inventor/yutaka-tsukada-cktgsy74

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Yutaka Tsukada - Innovator in Sewing Management Systems

Introduction

Yutaka Tsukada is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of sewing technology. His innovative approach has led to the development of a unique sewing management system.

Latest Patents

Yutaka Tsukada holds a patent for a sewing management system. This system includes a plurality of sewing machines that perform pattern sewing with a current pattern, which is a set sewing pattern. The management device acquires current pattern information indicating information on the current pattern of the sewing machine. It also determines whether the current pattern matches a planned sewing pattern. This invention enhances the efficiency and accuracy of sewing operations.

Career Highlights

Yutaka Tsukada is associated with Juki Corporation, a leading company in the sewing machine industry. His work at Juki Corporation has allowed him to apply his innovative ideas in a practical setting. His contributions have helped advance the technology used in sewing machines.

Collaborations

Due to space constraints, the collaborations section will be omitted.

Conclusion

Yutaka Tsukada's work in developing a sewing management system showcases his innovative spirit and dedication to improving sewing technology. His contributions continue to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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