Aichi, Japan

Yutaka Takagi

This inventor holds 1 USPTO granted patent. Top assignee: Agc Inc.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yutaka Takagi. Retrieved from https://idiyas.com/inventor/yutaka-takagi-58bexnsq

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Yutaka Takagi: Innovator in Glass Panel Technology

Introduction

Yutaka Takagi is a notable inventor based in Aichi, Japan. He has made significant contributions to the field of wiring board technology, particularly through his innovative patent related to glass panels.

Latest Patents

Yutaka Takagi holds a patent for a "Glass panel for wiring board and method of manufacturing wiring board." This invention features a glass panel that includes a first surface and a second surface, with an alignment mark constituted by a plurality of through holes. These holes penetrate the glass panel from the first surface to the second surface, ensuring precise alignment during manufacturing processes. The design specifies that the diameters of the openings at both surfaces must exceed a minimum diameter, enhancing the functionality of the wiring board.

Career Highlights

Takagi is associated with AGC Inc., a leading company in glass manufacturing and technology. His work has contributed to advancements in the production and application of glass materials in electronic devices.

Collaborations

Throughout his career, Yutaka Takagi has collaborated with esteemed colleagues such as Toshitake Seki and Toshikazu Horio. These partnerships have fostered innovation and development in their respective fields.

Conclusion

Yutaka Takagi's contributions to glass panel technology exemplify the importance of innovation in modern manufacturing. His patent reflects a commitment to enhancing the efficiency and effectiveness of wiring boards, marking him as a significant figure in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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