Shibukawa, Japan

Yutaka Ogino

This inventor holds 1 USPTO granted patent. Top assignee: Denka Company Limited. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yutaka Ogino. Retrieved from https://idiyas.com/inventor/yutaka-ogino

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Yutaka Ogino: Innovator in Flat-Plate Bonding Technology

Introduction

Yutaka Ogino is a notable inventor based in Shibukawa, Japan. He has made significant contributions to the field of manufacturing technology, particularly in the area of flat-plate bonding.

Latest Patents

Ogino holds a patent for a "Flat-plate bonding jig and method of manufacturing flat-plate laminated body." This innovative jig features a unique structure that allows for the bonding of flat plates while minimizing the formation of air bubbles. The jig includes a first surface, a second surface with multiple suction holes for securing the flat plate, and a main body that connects these surfaces. Additionally, it incorporates a communication means that links the suction holes to a suction mechanism.

Career Highlights

Yutaka Ogino is associated with Denka Company Limited, where he has been instrumental in advancing manufacturing processes. His work has led to improved efficiency and quality in the production of laminated bodies.

Collaborations

Ogino has collaborated with notable colleagues, including Yukio Eda and Toshiyuki Ibayashi, contributing to various projects that enhance manufacturing technologies.

Conclusion

Yutaka Ogino's innovative work in flat-plate bonding technology exemplifies the impact of dedicated inventors in the manufacturing sector. His contributions continue to influence advancements in this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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