Yutaka Nishide

Title: Yutaka Nishide: Innovator in Electric Wire Bundling Technology

Introduction

Yutaka Nishide is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of electric wire bundling technology, holding a total of 4 patents. His innovative designs have streamlined processes in various industries, particularly in wiring systems.

Latest Patents

Nishide's latest patents include a tape binding device for electric wire bundles and a wire laying-out apparatus. The tape binding device is designed to wind a tape piece with an adhesive surface around an electric wire bundle, effectively bundling the wires. The device features a pair of arms that lower to hold the tape piece and adhere it around the wire bundle, ensuring a secure and efficient binding process.

The wire laying-out apparatus automates the process of laying out electric wires on a designated plate. It utilizes a wire laying-out head that moves freely along X and Y directions, allowing for precise placement of wires. The apparatus includes multiple wire guiding devices and a selecting device that prevents tangling of wires during replacement, significantly reducing downtime.

Career Highlights

Throughout his career, Yutaka Nishide has worked with prominent companies such as Sumitomo Wiring Systems, Limited and Sumitomo Electric Industries, Limited. His experience in these organizations has contributed to his expertise in developing innovative solutions for wire management.

Collaborations

Nishide has collaborated with notable colleagues, including Teiji Sakuma and Akira Gotoh. Their combined efforts have led to advancements in the technologies related to electric wire bundling and laying-out systems.

Conclusion

Yutaka Nishide's contributions to electric wire technology through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to impact the efficiency of wiring systems, showcasing the importance of innovation in technology.