Company Filing History:
Years Active: 2024-2025
Title: Yutaka Matsusaka: Innovator in Composite Substrate Technology
Introduction
Yutaka Matsusaka is a prominent inventor based in Anan, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the development of composite substrates. With a total of 2 patents to his name, Matsusaka's work has garnered attention for its innovative approaches and practical applications.
Latest Patents
Matsusaka's latest patents include a composite substrate and a method of producing the composite substrate. The method involves providing a layered body that includes a base layer formed of a composite material containing diamond and a metal. This base layer has a first surface and a second surface opposite to the first surface. Additionally, a flat layer is bonded to the first surface of the base layer, with an upper surface that has a surface roughness Ra of 10 nm or less. An insulating layer is directly bonded to the upper surface of the flat layer. These innovations are crucial for enhancing the performance and reliability of semiconductor devices.
Career Highlights
Matsusaka is currently associated with Nichia Corporation, a leading company in the field of semiconductor and phosphor technology. His work at Nichia has allowed him to push the boundaries of what is possible in composite substrate technology. His contributions have not only advanced the company's research but have also had a lasting impact on the industry.
Collaborations
Throughout his career, Matsusaka has collaborated with notable colleagues, including Masatsugu Ichikawa and Shoichi Yamada. These collaborations have fostered a creative environment that has led to groundbreaking innovations in their respective fields.
Conclusion
Yutaka Matsusaka is a key figure in the development of composite substrates, with a focus on enhancing semiconductor technology. His patents reflect a commitment to innovation and excellence in engineering. His work continues to influence the industry and pave the way for future advancements.