The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 25, 2025
Filed:
Jan. 31, 2024
Applicant:
Nichia Corporation, Anan, JP;
Inventors:
Masatsugu Ichikawa, Tokushima, JP;
Shoichi Yamada, Anan, JP;
Takeshi Kihara, Tokushima, JP;
Yutaka Matsusaka, Anan, JP;
Assignee:
NICHIA CORPORATION, Anan, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/14 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); B22D 21/00 (2006.01); C04B 41/88 (2006.01);
U.S. Cl.
CPC ...
H01L 23/142 (2013.01); H01L 21/4882 (2013.01); H01L 23/3732 (2013.01); H01L 23/3733 (2013.01); B22D 21/007 (2013.01); C04B 41/88 (2013.01); H01L 21/4871 (2013.01); H01L 23/3736 (2013.01);
Abstract
A method of producing a composite substrate includes: providing a layered body including: a base layer formed of a composite material containing diamond and a metal, the base layer having a first surface, and a second surface opposite to the first surface, and a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and directly bonding an insulating layer to the upper surface of the flat layer.