Tokyo, Japan

Yutaka Hamasuna

This inventor holds 2 USPTO granted patents and 1 published patent application and 2 EPO patents. Top assignee: Dic Corporation. Active years: 2024-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yutaka Hamasuna. Retrieved from https://idiyas.com/inventor/yutaka-hamasuna

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

 

Average Co-Inventor Count = 4.2

ph-index = 1


Company Filing History:


Years Active: 2024-2025

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2 patents (USPTO):Explore Patents

Title: Yutaka Hamasuna: Innovator in Adhesive and Packaging Technologies

Introduction

Yutaka Hamasuna is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of adhesive and packaging materials, holding a total of 2 patents. His innovative work focuses on enhancing the performance and sustainability of packaging solutions.

Latest Patents

Hamasuna's latest patents include a laminating adhesive, laminate, and packaging material that exhibit excellent retorting resistance and content resistance. The adhesive comprises a polyol composition that includes a polyester polyol, which is a reaction product of a composition containing a polycarboxylic acid and a polyhydric alcohol. Notably, the polycarboxylic acid includes a tetramer acid. The laminate and packaging material are produced using this advanced adhesive technology.

Another significant patent is a separation and recovery method for laminated film. This method involves immersing the layered film in an alkaline solution while stirring or ultrasonically vibrating it at temperatures between 20° C. to 90° C. The process allows for the recovery of separated single-layered films that constitute the respective layers of the laminated film. The reactive adhesive used in this method contains both a polyisocyanate composition and a polyol composition, enhancing its effectiveness.

Career Highlights

Hamasuna is currently associated with Dic Corporation, where he continues to innovate in the field of adhesive technologies. His work has been instrumental in developing materials that meet the demands of modern packaging applications.

Collaborations

Hamasuna has collaborated with notable colleagues, including Shin-ichi Ohara and Hideoki Iwanami. Their combined expertise has contributed to the advancement of adhesive and packaging technologies.

Conclusion

Yutaka Hamasuna's contributions to adhesive and packaging materials demonstrate his commitment to innovation and sustainability. His patents reflect a deep understanding of material science and a dedication to improving product performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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