Company Filing History:
Years Active: 2018
Title: **Yuta Sagawa: Innovator in Die-Bonding Technologies**
Introduction
Yuta Sagawa, an accomplished inventor based in Tokyo, Japan, has made significant contributions to the field of semiconductor technologies. His innovative work focuses on enhancing the reliability and efficiency of semiconductor devices through the development of advanced materials.
Latest Patents
Yuta Sagawa holds a patent for a die-bonding layer formation film, which is crucial for securing processed products to adherends. This patented technology features an adhesive layer with unique properties, such as a storage elastic modulus that has a local minimum within a temperature range of 80°C to 150°C. Additionally, the adhesive layer demonstrates a shear strength between 20 N/2 mm and 50 N/2 mm during specific testing conditions, ensuring minimal bubble formation at the adhesive boundary, even under thermal stress. His patent underscores the importance of this technology in the reliability of semiconductor devices.
Career Highlights
Sagawa currently works at Lintec Corporation, a company recognized for its innovative materials in the electronics sector. His work at Lintec Corporation has enabled him to remain at the forefront of semiconductor advancements, contributing to the development of robust materials essential for modern technology.
Collaborations
Throughout his career, Yuta Sagawa has collaborated with notable coworkers such as Yuichiro Azuma and Hideaki Suzuki. These partnerships have facilitated an environment of innovation and have led to the successful development of advanced technologies within their field.
Conclusion
In conclusion, Yuta Sagawa's contributions to the semiconductor industry, particularly through his patent for a die-bonding layer formation film, highlight his role as a key innovator in Tokyo. His ongoing work at Lintec Corporation and collaborative efforts with esteemed colleagues demonstrate a commitment to advancing technology that enhances the functionality and reliability of semiconductor devices.