Singapore, Singapore

YunQin Lee

This inventor holds 5 USPTO granted patents and 5 published patent applications. Top assignee: The Procter Gamble Company. Active years: 2022-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: YunQin Lee. Retrieved from https://idiyas.com/inventor/yunqin-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 100.0

Average Co-Inventor Count = 2.5

ph-index = 2

Forward Citations = 23(Granted Patents)


Company Filing History:


Years Active: 2022-2025

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5 patents (USPTO):Explore Patents

Title: Insights into Inventor YunQin Lee

Introduction

YunQin Lee is an esteemed inventor based in Singapore, SG, renowned for his innovative contributions to the field of packaging technology. With a total of five patents under his name, Lee has made significant strides in enhancing product design and functionality.

Latest Patents

One of YunQin Lee's latest patents includes a novel packaging jar that exemplifies his commitment to improving consumer products. This invention not only showcases his technical expertise but also reflects the growing demand for sustainable and efficient packaging solutions.

Career Highlights

Currently, YunQin Lee is associated with The Procter & Gamble Company, where he collaborates with other talented professionals to drive innovation. His work at such a prestigious company highlights his role in shaping the future of consumer goods packaging.

Collaborations

Throughout his career, Lee has worked alongside notable colleagues including Robert Wayne Glenn, Jr. and Gloria Yu Hua Cheng. Their combined efforts demonstrate the power of teamwork in fostering creativity and facilitating groundbreaking inventions.

Conclusion

YunQin Lee's contributions to the field through his patents and collaborations reflect his dedication to innovation within the industry. As he continues to develop new and inventive solutions, the impact of his work is likely to resonate in the packaging industry for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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