Suwon, South Korea

Yunje Ji

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electro-Mechanics. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yunje Ji. Retrieved from https://idiyas.com/inventor/yunje-ji

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Yunje Ji: Circuit Board Innovation

Introduction

Yunje Ji is an inventor based in Suwon, South Korea. His patent work includes a circuit board design and a method for manufacturing it. The available information lists 1 patent associated with him.

Latest Patents

Ji’s patent, “Circuit Board and Manufacturing Method Thereof,” describes a circuit board with an insulation layer that has two opposing surfaces. A first pad layer includes a connection pad and a conductive layer stacked on it. Part of the pad layer is embedded in the insulation layer, while another part protrudes from its first surface. A second conductive layer is positioned on the first conductive layer.

Career Highlights

Ji is associated with Samsung Electro-Mechanics. His patent focuses on the structure and manufacture of a circuit board, including the arrangement of its insulation, pad, and conductive layers.

Collaborations

Yonghoon Kim and Seungeun Lee are identified as Ji’s coworkers. The available information does not specify their roles in the patent or any particular collaboration.

Conclusion

Yunje Ji’s listed patent documents a circuit board design and manufacturing approach involving layered conductive and insulating components, reflecting his connection to electronics innovation at Samsung Electro-Mechanics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…