Hsinchu, Taiwan

Yungtzu Chen

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yungtzu Chen. Retrieved from https://idiyas.com/inventor/yungtzu-chen-gob4uw6e

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Yungtzu Chen and Semiconductor Manufacturing Innovation.

Introduction

Yungtzu Chen is an inventor based in Hsinchu, Taiwan. His patent work concerns semiconductor devices and methods of manufacturing them. Chen is associated with Taiwan Semiconductor Manufacturing Co., Ltd.

Latest Patents

Chen is named on one patent, titled “Semiconductor Devices and Methods of Manufacture.” The invention describes forming an opening through a dielectric layer to expose a conductive region, then wet-cleaning and treating the opening before filling it with conductive material. The treatment uses a plasma mixture made from distinct sidewall and bottom treatment precursors. This approach addresses processing steps involved in manufacturing semiconductor devices.

Career Highlights

The available information identifies Chen’s work through his semiconductor patent and his association with Taiwan Semiconductor Manufacturing Co., Ltd. His patent focuses on opening treatment and conductive-material filling during device fabrication.

Collaborations

Chen’s listed coworkers include Chia-Yang Hung and Huan-Just Lin. Their names are provided as collaborators associated with his professional work.

Conclusion

Yungtzu Chen’s patent reflects work on semiconductor manufacturing processes, particularly the treatment and filling of openings in dielectric layers.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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