Yung Yi Lee

Title: Yung Yi Lee: Innovator in Substrate Processing Technology

Introduction

Yung Yi Lee is a notable inventor based in Sunnyvale, CA, who has made significant contributions to the field of substrate processing systems. His innovative approach has led to the development of a patented method that enhances the efficiency and effectiveness of substrate processing.

Latest Patents

Yung Yi Lee holds a patent for "Continuous plasma and RF bias to regulate damage in a substrate processing system." This patent describes methods of processing a substrate that involve supplying process gas to a processing chamber containing the substrate. Plasma is generated within the chamber, and after completing an initial substrate processing step, the plasma is maintained while adjusting various operating parameters. These parameters may include RF bias to a pedestal, plasma voltage bias, gas admixture, gas flow, gas pressure, and etch to deposition (E/D) ratio. The innovative aspect of this method is that it allows for one or more additional substrate processing steps to be performed without interrupting the plasma between the initial and subsequent steps.

Career Highlights

Yung Yi Lee is currently employed at Novellus Systems Incorporated, where he continues to advance substrate processing technologies. His work has been instrumental in improving the reliability and performance of processing systems used in various applications.

Collaborations

Yung Yi Lee has collaborated with notable colleagues, including Liqi Wu and Huatan Qiu, contributing to a dynamic and innovative work environment.

Conclusion

Yung Yi Lee's contributions to substrate processing technology through his patent and work at Novellus Systems Incorporated highlight his role as a key innovator in the field. His methods are paving the way for advancements in processing systems, ensuring greater efficiency and effectiveness in substrate applications.