Taipei, Taiwan

Yung-Ti Chung

This inventor holds 7 USPTO granted patents and 3 published patent applications. Top assignee: Wiwynn Corporation. Active years: 2022-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yung-Ti Chung. Retrieved from https://idiyas.com/inventor/yung-ti-chung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7 

% Patents Active = 100.0

Average Co-Inventor Count = 2.9

ph-index = 1


Company Filing History:


Years Active: 2022-2026

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7 patents (USPTO):Explore Patents

Title: Yung-Ti Chung: Innovator in Embossed Pattern Technology

Introduction

Yung-Ti Chung is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of technology, particularly with his innovative designs and patents. With a total of 7 patents to his name, Chung has established himself as a key figure in his industry.

Latest Patents

One of his latest inventions is a board with an embossed pattern. This innovative design showcases his ability to combine functionality with aesthetic appeal. The embossed pattern not only enhances the visual aspect of the board but also serves practical purposes in various applications.

Career Highlights

Chung is currently employed at Wiwynn Corporation, where he continues to push the boundaries of technology. His work at the company has allowed him to collaborate with other talented individuals in the field, further enhancing his expertise and contributions.

Collaborations

Some of his notable coworkers include Jheng-Ying Jiang and Chien-Yun Hsu. Their collaborative efforts have led to advancements in their respective projects, showcasing the power of teamwork in innovation.

Conclusion

Yung-Ti Chung is a remarkable inventor whose work in embossed pattern technology has made a significant impact. His contributions at Wiwynn Corporation and his collaborations with talented colleagues highlight his dedication to innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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