This inventor holds 2 USPTO granted patents. Top assignees: Qpl Limited, Quality Platers Limited. Active years: 2003-2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2003-2004
Title: Yung Piu Lau: Innovator in Integrated Circuit Packaging
Introduction
Yung Piu Lau is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of integrated circuit packaging, holding a total of 2 patents. His innovative approaches have enhanced the efficiency and effectiveness of automated wire bonding processes.
Latest Patents
One of Yung Piu Lau's latest patents is focused on a leadframe designed for enhanced downbond registration during the automatic wire bond process. This invention aims to improve the visual detectability of a leadframe that includes a die attach pad and multiple contacts. The leadframe features at least one of a ring, a line, and an array of dots plated on the die attach pad and around its periphery. Additionally, the leadframe undergoes surface treatment to induce a color change, enhancing the visual detectability of these features.
Career Highlights
Throughout his career, Yung Piu Lau has worked with various companies, including Quality Platers Limited and Qpl Limited. His experience in these organizations has contributed to his expertise in the field of integrated circuit packaging.
Collaborations
Yung Piu Lau has collaborated with professionals such as Mohamed Lebbai Moosa Naina, further enriching his work and contributions to the industry.
Conclusion
Yung Piu Lau's innovative patents and career achievements highlight his significant role in advancing integrated circuit packaging technology. His work continues to influence the field and improve manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile