Yung-Chang Lien

Title: Yung-Chang Lien: Innovator in Semiconductor Packaging

Introduction

Yung-Chang Lien is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Yung-Chang Lien's latest patents include a semiconductor package structure. This innovative structure comprises a substrate, a frame, a redistribution layer, and a first semiconductor die. The substrate features a wiring structure and is encased in a molding material. The frame is positioned within the molding material, surrounding the substrate. The redistribution layer is placed over the substrate and is electrically connected to the wiring structure. Finally, the first semiconductor die is situated atop the redistribution layer.

Career Highlights

Yung-Chang Lien is currently employed at MediaTek Corporation, a leading company in the semiconductor industry. His role involves developing advanced packaging solutions that contribute to the performance of electronic devices.

Collaborations

Yung-Chang Lien collaborates with Tzu-Hung Lin, a fellow innovator in the field. Together, they work on projects that push the boundaries of semiconductor technology.

Conclusion

Yung-Chang Lien's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His patents reflect a deep understanding of the complexities involved in semiconductor design and manufacturing.