Yundong Meng

Title: Yundong Meng and Thermosetting Resin Innovation.

Introduction

Yundong Meng is an inventor based in Dongguan, China. His patent work concerns thermosetting resin materials and their potential use in copper-clad plates.

Latest Patents

Meng is associated with one patent, 1 patent: “Thermosetting Resin Composition and Application Thereof.” The invention describes a composition containing a star-shaped styrene-butadiene-styrene triblock copolymer, a linear olefin resin containing 1,2-ethylene and a modifier, and at least one resin or small-molecule compound substituted with an acrylic group. The patent specifies ranges for the proportions of these components.

According to the provided description, the composition resists phase separation under initiator conditions and offers heat resistance, a relatively low dielectric constant, and low dielectric loss tangent. These properties are intended to support the dielectric performance and thermal reliability of copper-clad plates.

Career Highlights

Meng is associated with Shengyi Technology Co., Ltd., a company working in materials and related technologies. His patent reflects an application-focused approach to resin formulation, addressing material stability and performance requirements for electronic substrates.

Collaborations

Cheng Luo and Shanyin Yan are identified as Meng’s coworkers. The information provided does not specify their roles in the patent or the nature of their collaboration.

Conclusion

Yundong Meng’s patent centers on a thermosetting resin composition designed to combine phase stability, heat resistance, and useful dielectric properties for copper-clad plate applications.