Company Filing History:
Years Active: 2017
Title: **Inventor Profile: Yun-Yeu Yeh**
Introduction
Yun-Yeu Yeh is an esteemed inventor based in Taipei, Taiwan, recognized for his innovative contributions in the field of heat dissipation technologies. With a focus on maximizing thermal efficiency, Yeh has developed novel solutions that address the rising demand for effective heat management in various applications.
Latest Patents
Yeh holds a patent for a "Heat dissipation structure with heat pipes arranged in two spaced and partially overlapped layers." This invention features a sophisticated design that includes a radiation fin set and a heat-dissipation spacer. The structure defines opposing surfaces, upon which multiple heat pipes are strategically placed to enhance thermal performance. A key aspect of this design is the overlapping configuration of the heat pipes, which is intended to optimize heat transfer and improve overall efficiency.
Career Highlights
Yun-Yeu Yeh has made significant strides in his career as an inventor while working at Tai-sol Electronics Co., Ltd. His dedication to research and development has led to the successful creation of technologies that serve various industries. The focus on practical and scalable solutions is a hallmark of his work, making a lasting impact in the field of electronics.
Collaborations
Throughout his career, Yun-Yeu has collaborated with fellow inventor Sheng-Chin Chan. Together, they have sought to push the boundaries of innovation, leading projects that are designed to enhance electronic device performance and reliability through improved thermal management strategies.
Conclusion
Yun-Yeu Yeh's contributions to the field of heat dissipation highlight his ingenuity and commitment to advancing technology. His patent serves as a testament to his innovative spirit and the potential for future advancements in thermal management solutions. As technology continues to evolve, inventors like Yeh play a crucial role in developing tools that meet the ever-increasing demands of modern applications.