The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 2017
Filed:
May. 29, 2015
Tai-sol Electronics Co., Ltd., Taipei, TW;
Yun-Yeu Yeh, Taipei, TW;
Sheng-Chin Chan, Taipei, TW;
TAI-SOL ELECTRONICS CO., LTD, Taipei, TW;
Abstract
A heat dissipation structure with heat pipes arranged in two spaced and partially overlapped layers is disclosed to include a radiation fin set, a heat-dissipation spacer placed on the radiation fin set and defining opposing first surface and second surface, a first heat dissipation layer including multiple first heat pipes with respective first segments thereof placed on the first surface of the heat-dissipation spacer, and a second heat dissipation layer including multiple second heat pipes with respective first segments thereof placed on the second surface of the heat-dissipation spacer. At least a part of the first segment of at least one first heat pipe of the first heat dissipation layer is disposed overlapped on at least a part of the first segment of at least one second heat pipe of the second heat dissipation layer in a parallel manner.