Yun-yen Lee

Title: Innovations by Yun-yen Lee in Rigid-Flexible Printed Circuit Boards

Introduction

Yun-yen Lee is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronics, particularly in the development of rigid-flexible printed circuit boards. His innovative approach addresses critical challenges in electronic device manufacturing.

Latest Patents

Yun-yen Lee holds a patent for a "Rigid-flexible printed circuit board and preparation method therefor." This patent describes a preparation method that begins with a flexible board divided into two regions along its extension direction. A first protective layer is applied to the flexible board, with distinct parts covering the two regions respectively. A rigid board is then positioned in the second region, designed with a notch to alleviate height discrepancies introduced by the protective layer. The final step involves laminating the rigid board to the flexible board. This ensures that the portion of the rigid board adjacent to the second portion is aligned flush with the rest, resulting in a rigid-flex PCB with improved flatness. This method is particularly significant for applications requiring precise structural integrity and consistency in electronic devices. He has 1 patent to his name.

Career Highlights

Yun-yen Lee is currently associated with Triple Win Technology (Shenzhen) Co., Ltd. His work at this company focuses on advancing technologies that enhance the performance and reliability of electronic components. His expertise in printed circuit board design has positioned him as a key player in the industry.

Collaborations

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Conclusion

Yun-yen Lee's innovative work in rigid-flexible printed circuit boards showcases his commitment to enhancing electronic device manufacturing. His contributions are vital for the future of technology in this field.