Hwaeong-si, South Korea

Yun-Hyoek Im


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Innovations of Yun-Hyoek Im in Semiconductor Technology

Introduction

Yun-Hyoek Im is a notable inventor based in Hwaeong-si, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent that addresses thermal management in semiconductor packages. His work is crucial for enhancing the performance and reliability of electronic devices.

Latest Patents

Yun-Hyoek Im holds a patent for a "Semiconductor package with thermal dissipating member and method of manufacturing the same." This invention includes a circuit board, a semiconductor chip mounted on the circuit board, and an encapsulant that protects the semiconductor chip. A key feature of this patent is the thermal dissipating member, which consists of a heat spreader and a heat capacitor. This design allows the semiconductor package to manage excess heat effectively, thereby protecting the semiconductor chip from overheating and improving its performance duration. He has 1 patent to his name.

Career Highlights

Yun-Hyoek Im is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role involves research and development in semiconductor technologies, where he applies his expertise to create innovative solutions that meet the demands of modern electronics.

Collaborations

Throughout his career, Yun-Hyoek Im has collaborated with talented individuals such as Kyol Park and Hee-Seok Lee. These collaborations have contributed to the advancement of semiconductor technologies and have fostered a creative environment for innovation.

Conclusion

Yun-Hyoek Im's contributions to semiconductor technology exemplify the importance of innovation in the electronics industry. His patented inventions not only enhance device performance but also pave the way for future advancements in the field.

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