The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 2015
Filed:
Dec. 03, 2013
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package and a method of manufacturing the same are disclosed, wherein the semiconductor package includes a circuit board, a semiconductor chip mounted on the circuit board, an encapsulant positioned on the circuit board and encapsulating the semiconductor chip to the circuit board, and a thermal dissipating member positioned on the encapsulant and having a heat spreader that dissipates a driving heat from the semiconductor chip and a heat capacitor that absorbs excess driving heat that exceeds a heat transfer capability of the heat spreader, such that when a high power is applied to the package, the excess heat is absorbed into the heat capacitor as a latent heat and thus the semiconductor chip is protected from an excessive temperature increase caused by the excess heat, thereby increasing a critical time and performance duration time of the semiconductor package.